Point：317
Components type：83
PCB size： 179*141mm
Minimum package size of resistance capacitance sensing: 0603
Minimum device pin spacing：0.65mm
Welding mode：Reflow soldering for double side + Wave soldering.
Manufacturing process: SMD processing
1943 Technology provides professional, end-to-end electronic manufacturing solutions engineered for high-performance motion control systems. We specialize in accommodating the stringent design rules of motion controller hardware, offering a seamless transition from initial design files to fully tested, production-ready assemblies. Through our dedicated PCBA manufacturing one-stop NPI service, we help engineering teams accelerate product validation and scale manufacturing with minimal risk.
Our production facility is equipped with automated SMT lines and high-precision inspection tools tailored to the high-density and multi-layered configurations typical of modern motion controllers.
Fine-Pitch SMT & Placement Precision: We support surface mount component packages down to 0201 and integrated circuit pin spacing down to 0.5mm, ensuring reliable soldering of micro-controllers, DSPs, and power driver ICs.
Thermal & Power Management: Motion control circuit boards require exceptional heat dissipation due to high-current pathways. We support heavy copper boards, rigid-flex substrates, and advanced thermal interface materials (TIM) application.
Mixed Technology Assembly: We integrate double-sided reflow soldering with selective wave soldering for heavy through-hole components (such as terminals, connectors, and electrolytic capacitors) to guarantee mechanical strength under continuous industrial vibration.
We recognize that successful motion controller development relies heavily on the prototyping and pre-production stages. Our structured NPI Services are designed to identify design-for-manufacturability (DFM) and design-for-testing (DFT) issues before volume production begins.
Design and Engineering Review: Our engineering team conducts a thorough front-end DFM review of your Gerber files and Bill of Materials (BOM) to eliminate potential manufacturing bottlenecks.
BOM Management & Component Procurement: With established component supply networks, we source authentic, industrial-grade active and passive components, minimizing risks associated with lead times and counterfeits.
First Article Inspection (FAI): Every NPI run undergoes automated and manual FAI checks to verify value accuracy and polarity alignment before the main batch is processed.
Our one-stop turnkey pipeline covers every stage of the manufacturing lifecycle:
PCB Fabrication: High-TG, multi-layer, FR-4 substrates with high-quality surface finishes (ENIG, HASL, or OSP) ensuring excellent solderability.
Assembly & Soldering: Strictly controlled thermal profiling for both leaded and lead-free (RoHS compliant) assembly processes.
Comprehensive Testing: We execute In-Circuit Testing (ICT), Functional Testing (FCT), and Automated Optical Inspection (AOI). For motion controllers, custom functional testing rigs can be integrated to simulate actual operating voltage, I/O signals, and motor loads.
Box Build & Conformal Coating: Automated conformal coating to protect boards from moisture, dust, and chemical exposure in harsh industrial environments, followed by final product enclosure assembly.
Let the products quickly and stably realize marketization and become the global electronic intelligence innovation enabler
2026-08-06
