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Functional testing (FCT) verifies that a printed circuit board assembly (PCBA) performs its intended electrical and operational functions under controlled conditions.
Among the most widely used inspection technologies in PCBA NPI are Automated Optical Inspection (AOI), Solder Paste Inspection (SPI), and X-Ray Inspection.
Component obsolescence during the New Product Introduction (NPI) phase represents a critical vulnerability for electronics OEMs, product designers, and contract manufacturing partners.
In New Product Introduction (NPI) for PCBA, the choice between kitted and turnkey component sourcing shapes project timelines, risk allocation, cost structure, and resource demands.